汪正平教授
香港城市大學香港高等研究院資深院士
美國喬治亞理工學院「董事教授」暨材料科學及工程學系Charles Smithgall Institute講座教授
美國國家工程院院士
中國工程院外籍院士
香港科學院創院院士
聯絡資料
| 電郵: | cp.wong@mse.gatech.edu |
|---|
Professor Ching Ping Wong, is currently Regents’ Professor and the Charles Smithgall Institute Endowed Chair in the School of Materials Science and Engineering at the Georgia Institute of Technology (GT). He was Emeritus Professor at The Chinese University of Hong Kong.
Professor Wong received his BS degree from Purdue University, and his PhD degree from the Pennsylvania State University. After his doctoral study, he was awarded a postdoctoral fellowship under Nobel laureate Professor Henry Taube at Stanford University. Prior to joining Georgia Institute of Technology (GT), he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992.
Professor Wong’s research interests lie in the fields of polymeric electronic materials, electronic, photonic and MEMS packaging and interconnect, interfacial adhesions, and nano-functional material syntheses and characterizations.
Professor Wong has published widely with over 1000 technical papers. He has yielded fruitful research results and holds over 65 US patents. Professor Wong has made significant contributions to the industry by pioneering new materials, which fundamentally changed the semiconductor packaging technology.
Professor Wong has successfully motivated and nurtured numerous inquisitive young minds over the years. As a distinguished scholar, Professor Wong was awarded numerous international honours, such as the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award in 2004, named holder of the Charles Smithgall Chair (one of the two GT Institute Chairs) in 2005, the GT Outstanding PhD Thesis Advisor Award, the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’s Monie Ferst Award in 2007, the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008 and the IEEE CPMT David Feldman Award in 2009. He has also received the 2012 International Dresden Barkhausen Award (Germany).
Professor Wong is a member of the US National Academy of Engineering (elected in 2000), and a foreign academician member of the Chinese Academy of Engineering (elected in 2013).
Professor Wong received his BS degree from Purdue University, and his PhD degree from the Pennsylvania State University. After his doctoral study, he was awarded a postdoctoral fellowship under Nobel laureate Professor Henry Taube at Stanford University. Prior to joining Georgia Institute of Technology (GT), he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992.
Professor Wong’s research interests lie in the fields of polymeric electronic materials, electronic, photonic and MEMS packaging and interconnect, interfacial adhesions, and nano-functional material syntheses and characterizations.
Professor Wong has published widely with over 1000 technical papers. He has yielded fruitful research results and holds over 65 US patents. Professor Wong has made significant contributions to the industry by pioneering new materials, which fundamentally changed the semiconductor packaging technology.
Professor Wong has successfully motivated and nurtured numerous inquisitive young minds over the years. As a distinguished scholar, Professor Wong was awarded numerous international honours, such as the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award in 2004, named holder of the Charles Smithgall Chair (one of the two GT Institute Chairs) in 2005, the GT Outstanding PhD Thesis Advisor Award, the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’s Monie Ferst Award in 2007, the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008 and the IEEE CPMT David Feldman Award in 2009. He has also received the 2012 International Dresden Barkhausen Award (Germany).
Professor Wong is a member of the US National Academy of Engineering (elected in 2000), and a foreign academician member of the Chinese Academy of Engineering (elected in 2013).
